Director
no pic

Suresh K. Sitaraman, Ph.D

Professor
George W. Woodruff School of Mechanical Engineering
813 Ferst Drive, MARC Building, Room 471
Georgia Institute of Technology
Atlanta, GA 30332-0405
email: suresh.sitaraman@me.gatech.edu







Post-Doctoral Fellow

Ju Xu ,PhD, Ircset-Marie Curie Research Fellow. (University College Cork, Ireland)
Nanowire Z axis interconnect
January 2011– 2012

Past Post-Doctoral Fellows

Raghuram Pucha, Ph.D. (Indian Institute of Science)

Yeong Kim , Ph.D. (University of Illinois, Urbana-Champagne)
ChipSeal Studies
October 2002– 2003

Zhao Hui Shan , Ph.D. (Hong Kong University of Science and Technology)
Nanoindentation Studies and Material Characterization
 
January 2001 – 2003

Vish Sundararaman, Ph.D. (Syracuse University)
MCM-D and VSPA Studies
April 1997 – March 1999
Employed at Texas Instruments

Hurang Hu, Ph.D. (Syracuse University)
NIST Microspring Studies
April 1999 – Sep. 2000
Employed as Asst. Professor at Clark Atlanta University

Visiting Scholars and Students

Ye Tian
Visiting Student from School of Material Science
Hua Zhong University of Science and Technology, China
Fall 2010 - Fall 2012


Visited Scholars and Students

Suman Addya
Visiting Electrical Engineer BS'08
University of Pennsylvania, Philadelphia
Summer 2010

John Pang, Ph.D.
Visiting Scholar from the School of Mechanical and Production Engineering
Nanyang Technological University, Singapore
Summer and Fall 1997

Rudolf Krondorfer
Visiting Ph.D. student from Norwegian University of Science and Technology
Fall 2001 and Spring 2002

Ph.D. Students

 

no picJamie Ahmad
Multi-Component Board Assembly Reliability

gte592w@prism.gatech.edu

 



no picKevin Klein
Stress-Engineered Springs

gt6939a@prism.gatech.edu

 



no picXi Liu resume
Reliability analysis of 3D Integrated Package with Through-Silicon Vias (TSV)
xi.liu@gatech.edu 


 

no picNicholas Ginga
Interface Characterization for Advanced Micro-Systems Applications

nick.ginga@gatech.edu

 


no picRaphael Okereke resume
Compliant Interconnect
ralphyralph@gatech.edu


 

 

no picGregory Ostrowicki
Thin film Interfacal Characterization

gtostrowicki@gatech.edu
 

 


no picSathyanarayanan Raghavan resume
Ultra Low K Dielectric Cracking
sathya@gatech.edu

 


 

nopicChristine Taylor resume
Stress Sensors
National Defense Science and Engineering Graduate Fellowship, 2008-2011

Presidential Fellowship, 2008-2013
FACES Fellowship 2008-2011
C.Taylor@gatech.edu


Casey Woodrum
Thermoelectric coolers
dwoodrum3@gatech.edu

 


Masters Students

Anirudh Bhat nopic
Compliant Interconnect Behavior
abhat@gatech.edu
 



Justin Chowno pic
Lead-free solders
justin.chow@gatech.edu

 



Danny Kang resume
Cohesive Zone Modeling
justin.chow@gatech.edu

 




Joel Toussaint

jtoussaint3@gatech.edu
 




Undergraduate Research Assistants

Taylor Breault
Solar Applications/
Thin film Interfacal Characterization
2010

Graduated Ph.D. Students

Krishna Tunga
Thermo-mechanical modeling of BGA packages, laser moire interferometry and lead-free solder microstructure evolution

2008

Employed at IBM*

 


Jiantao Zheng
Process Dependent Interface Characterization for Advanced Micro-Systems Applications

2008
Employed at IBM*



Karan Kacker
Lead-free solders and G-helix interconnects

2008
Employed at Microsoft Corporation*


 



Injoong Kim
Computer-aided electronic system design for reliability

2007
Employed at LG Electronics* 

 

 

Shashikant Hegde
Thermo-Mechanical Modeling and Reliability of High-Speed Optoelectronic Packaging

2007
Employed at Apple Inc.*



Sakerthraman Mahalingam
Reliability of Flipchip Package with Nano-filled Underfilled Material

2005
Employed at General Electric* 



Andrew Perkins
High And Low Cycle Fatigue Failure Of Solder Joints
SMTA Hutchins Grant, 2003
SMTA Atlanta Scholarship, 2002-2004
Georgia Tech ME Presidential Fellowship, 2000-2004
NSF Honorable Mention, 2001
2007
Employed at Micron Technologies*

Mitul Modi
Interfacial Behavior for Micro-Contact Springs for High-Density Packaging

Presidential Fellowship, 1999-2003
2003
Employed at Intel Corporation*

 

Angela Qi Zhu
Design, Fabrication and Thermo-mechanical Reliability of compliant interconnects for High I/O density Packaging

Sigma Xi Outstanding Ph.D. Thesis Award, Qi Zhu, 2003
2003
Employed at Applied Materials Corporation*

 

Dennis Lunyu Ma
Design and Thermo-Mechanical Study of Micro-Contact Springs for Probing and High I/O Density Packaging

2003 (co-advisor: Dr. R. Fulton)
Employed at Form Factor*


 

Stelios Michaelides
Physics-Based Process Modeling, Reliability Prediction and Design Guidelines for Flip-Chip Devices
Onassis Foundation Scholarship, 1997-1999
Leventis Foundation Scholarship, 1995-1997
1999


Rajiv Dunne
An Integrated process Modeling Methodology and Module for Sequential Multilayered High-Density Substrate Fabrication for Microelectronic Packages
Outstanding Poster Award (Graduate/ART) - Second Place - Thermo-Mechanical Modeling of SLIM - IAB/NSF Site Visit, Oct. 1997
2000
Employed at Texas Instrument

Weidong Xie
Thermo-Mechanical Evaluation of Interfacial Integrity in Multilayered Microelectronic Packages

2001
Employed at Agere Systems*


Graduated Masters Students

Seke Godo
Thermo-Mechanical Reliability of Flip-Chip Packages in Harsh Environments

 

 

Thomas Sokol
G-helix interconnects

 

 

 
Luke Mcclasin
Package Warpage Caculation
2008



Marc Griswold
Thermo-mechanical Parametric Modeling and Reliability Studies for Lead Free Flip Chip Packages
2006
Employed at Elan Motosport Technologies
*


 

Manoj Damani
Physics-Based Reliability Assessment of Embedded Passives
2004
Employed at Qualcomm
*



 

Kang Joon (KJ) Lee
Fabrication and Reliability of Embedded Passives
2005
Employed at Intel
*



 

George Lo
Electroplated Compliant High-Density Interconnects for Next-Generation Microelectronic Packaging
2004
Employed at General Electric Corporation*


 

Francis Classe
Asymmetric Thermal Profiles: A Different Approach to Accelerated Qualification of Chip Scale Packages
2003
Employed at Spansion*

 

 

Uramela Suljozovik
2003

Employed at Intel Corporation
*

 



Gnyaneshwar Ramakrishna
Physics-based Modeling Methodology for Reliability of Microvias
2002
Employed at Cisco Corporation
*


 

James Pyland
Damage Metric Based-Thermal Cycling Guidelines For Area-Array Packages Used In Harsh Thermal Conditions
IMAPS Educational Foundation Scholarship
2002
Employed at Cameron Corporation
*

 

Hernan Mercado-Corujo
Study of the Thermo-Mechanical Reliability of a Plated-
Through-Hole / Press-Pin Assembly
2001
Employed at Eaton Corporation
*

Mudasir Ahmad
Structural Thermal-Electric Modeling and Analysis of Micro-Springs for Microelectronic Probing and Packaging Applications
2001
Employed at Cisco Systems
*


Rajiv Raghunathan
Virtual Qualification Methodology for Next-Generation Area-
Array Devices
2000
Employed at Siebel Corporation
*


Joe Haemer
Thermo-Mechanical Modeling and Design of Micro-springs
for Microelectronic Probing and Packaging
IMAPS Educational Foundation Scholarship, 1999-2000
2000
Employed at Nanonexus, Inc.
*


Manjula Surendran Variyam
Palletization and Design-of-Simulations for Large Area Processing and Assembly in Electronic Packaging
1999
Employed at Texas Instruments
*

 

Carlton Hanna
Study of Thermo-Mechanical Reliability of Area-Array Packages
1999
Employed at Intel Corp.
*

 

Richard Harries
Process Modeling and Interfacial Delamination in a Peripheral Array Package
1998
Employed at Failure Analysis Associates
*



Jill Conley
Hygro-Thermo Mechanical Behavior of Fiber-Optic Apparatus
1998
Employed at DuPont 
*


 

Kyle Smith
Thermo-Mechanical Behavior and Reliability of High-Density Interconnect (HDI) Vias
1997
Employed at Boeing
*


 

Sean Murphy
Thermo-Mechanical Reliability of the VSPA Package Solder
Joints
NSF Honorable Mention
1997
Employed at Hewlett-Packard
*


Jorg Sizemore
Elastic-Plastic Modeling of PTH under Solder Shock Test
1996
Employed at Pratt-Whitney
* 

BSME Research Topics Students

Sidharth Shah
Failure analysis of plastic ball grid array package
ME 4901, Special Problems
Fall 2007

Kevin Klein
Thermo-Mechanical Reliability of Microelectronic Packages and Probes
ME 4901, Special Problems
Spring 2000

Raphael de Cardenas
Thermo-Mechanical Modeling of Quad-Flat Packs
ME 4901 Special Problems
Summer 1997

Caliph Johnson
Thermo-Mechanical Behavior of Vias
ME 4901 Special Problems
Winter 1997

Brian O’Hara
Thermo-Mechanical Behavior of Flip-Chip Assembly
ME 4901 Special Problems
Winter 1997

Jill Conley
Elastic-Plastic Modeling of Plated-Through Holes in Solder Shock Test
ME 4901 Special Problems
Sigma Xi Award for Outstanding Undergraduate Research
Winter 1996

Marcial Machado
Virtual Reality and its Applications in the Design and Manufacturing Process
ME4901 Special Problems
Spring 1995

Undergraduate Research Assistants

Rob Lee
Compliant Interconnects
2011

KJ Lee
Thermo-Mechanical Reliability of Plated-Through-Hole/Press-Pin Assemby
 2001

Andrew Perkins
Thermo-Mechanical Modeling and Experiments for Microelectronic Packaging Reliability
2000

Meera Srinivasan
CASPaR Development
1998

Jason Tsai
Thermo-Mechanical Analysis of Flip-Chips with Solder Voids
 1997

Mark Lawson
CASPaR Development
1997

Caliph Johnson
Process Modeling and Thermal Cycling of Vias
Outstanding Poster Award (Undergraduate) - First Place - Thermo-Mechanical Reliability of Vias - C. Johnson - IAB/NSF Site Visit, Oct. 1997
1997

Anthony Belvin, GT SUPREEM Scholar
A Comparison of Substrate Materials in Printed Wiring Boards
1996

* last known employer